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 DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
M3D302
BF485PN NPN/PNP high voltage transistors
Product specification 2000 Aug 02
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
FEATURES * High voltage (max. 350 V) * Low current (max. 200 mA) * High power dissipation (600 mW) * Two independently working transistors. APPLICATIONS * Complementary high-voltage configurations * Hook switch in telephone applications. DESCRIPTION NPN/PNP transistors in a SOT457 (SC-74) plastic package. MARKING CODE TYPE NUMBER BF485PN CODE HS
1 Top view 2 3 6 handbook, halfpage 5 4 6
BF485PN
PINNING PIN 1 and 4 5 and 2 6 and 3 DESCRIPTION emitter TR1; TR2 base TR1; TR2 collector TR1; TR2
5
4
TR1 TR2
1
2
3
MAM439
Fig.1 Simplified outline (SOT457) and symbol
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. - - - - - Tamb 25 C; note 1 - -65 - -65 Tamb 25 C; note 1 - MAX. UNIT
Per transistor; for the PNP transistor with negative polarity VCBO VCEO VEBO IO ICM Ptot Tstg Tj Tamb Per device Ptot Note 1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2. total power dissipation 300 mW collector-base voltage collector-emitter voltage emitter-base voltage output current (DC) peak collector current total power dissipation storage temperature junction temperature operating ambient temperature range open emitter open base open collector 350 350 6 100 200 600 +150 150 +150 V V V mA mA mW C C C
2000 Aug 02
2
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
THERMAL CHARACTERISTICS SYMBOL Rth j-a Note PARAMETER from junction to ambient CONDITIONS in free air; note 1
BF485PN
VALUE 208
UNIT K/W
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2. CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - 60 50 - - - 50 MAX. UNIT
Per transistor; for the PNP transistor with negative polarity ICBO IEBO hFE VCEsat VBEsat Cc fT collector-base cut-off current emitter-base cut-off current DC current gain saturation voltage saturation voltage collector capacitance transition frequency IE = 0; VCB = 300 V; IE = 0; VCB = 250 V; Tj = 150 C IC = 0; VEB = 5 V IC = 1 mA; VCE = 10 V IC = 30 mA; VCE = 10 V IC = 20 mA; IB = 2 mA IC = 20 mA; IB = 2 mA IE = Ie = 0; VCB = 20 V; f = 1 MHz IC = 10 mA; VCE = 20 V; f = 100 MHz 50 50 100 - - 250 850 6 - mV mV pF MHz nA A nA
handbook, halfpage
300
MLD391
handbook, halfpage (6)
200
MLD392
(5)
(4)
(3)
(2)
(1)
hFE
(1)
IC (mA) 150
(7) (8)
200
(2)
100
(9) (10)
100
(3)
50
0 10-1
1
10
IC (mA)
102
0 0 TR1 (NPN). 2 4 6 8 10 VCE (V)
TR1 (NPN); VCE = 10 V. (1) Tamb = 150 C. (2) Tamb = 25 C. (3) Tamb = -55 C.
(1) (2) (3) (4)
IB = 30 mA. IB = 27 mA. IB = 24 mA. IB = 21 mA.
(5) IB = 18 mA. (6) IB = 15 mA. (7) IB = 12 mA.
(8) IB = 9 mA. (9) IB = 6 mA. (10) IB = 3 mA.
Fig.2
DC current gain as a function of collector current: typical values.
Fig.3
Collector current as a function of collector-emitter voltage; typical values.
2000 Aug 02
3
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
BF485PN
MLD393
handbook, halfpage
1000 VBE
handbook, halfpage
(1) (2)
1000
MLD394
(mV) 800
VBEsat (mV) 800
(2) (1)
600
(3)
600
400
(3)
400 200
0 10-1 TR1 (NPN); VCE = 10 V. (1) Tamb = -55 C. (2) Tamb = 25 C. (3) Tamb = 150 C.
1
10
IC (mA)
102
200 10-1
1
10
IC (mA)
102
TR1 (NPN); IC/IB = 10. (1) Tamb = -55 C. (2) Tamb = 25 C. (3) Tamb = 150 C.
Fig.4
Base-emitter voltage as a function of collector current; typical values.
Fig.5
Base-emitter saturation voltage as a function of collector current.
103 handbook, halfpage
MLD395
handbook, halfpage
300
MLD396
VCEsat (mV)
hFE
(1)
200
(1)
102
(2) (2) (3)
100
(3)
10 10-1
1
10
IC (mA)
102
0 -10-1
-1
-10
IC (mA)
-102
TR1 (NPN); IC/IB = 10. (1) Tamb = 150 C. (2) Tamb = 25 C. (3) Tamb = -55 C.
TR2 (PNP); VCE = -10 V. (1) Tamb = 150 C. (2) Tamb = 25 C. (3) Tamb = -55 C.
Fig.6
Collector-emitter saturation voltage as a function of collector current: typical values.
Fig.7
DC current gain as a function of collector current: typical values.
2000 Aug 02
4
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
BF485PN
handbook, halfpage (6)
-200 IC (mA)
MLD397
(5)
(4)
(3)
(2)
(1)
handbook, halfpage
-1000 VBE (mV)
MLD398
(1)
-150
(7) (8)
-800
(2)
-600
(3)
-100
(9) (10)
-400
-50 -200
0 0 TR2 (PNP). (1) IB = -50 mA. (2) IB = -45 mA. (3) IB = -40 mA. (4) IB = -35 mA.
-2
-4
-6
-8 -10 VCE (V)
0 -10-1
-1
-10
IC (mA)
-102
(5) IB = -30 mA. (6) IB = -25 mA. (7) IB = -20 mA.
(8) IB = -15 mA. (9) IB = -10 mA. (10) IB = -5 mA.
TR2 (PNP); VCE = -10 V. (1) Tamb = -55 C. (2) Tamb = 25 C. (3) Tamb = 150 C.
Fig.8
Collector current as a function of collector-emitter voltage; typical values.
Fig.9
Base-emitter voltage as a function of collector current; typical values.
handbook, halfpage
-1000 (mV) -800
MLD399
-103 handbook, halfpage
MLD400
VBEsat
(1)
VCEsat (mV)
(2)
(1)
-600
-102
(2) (3)
(3)
-400
-200 -10-1
-1
-10
IC (mA)
-102
-10 -10-1
-1
-10
IC (mA)
-102
TR2 (PNP); IC/IB = 10. (1) Tamb = -55 C. (2) Tamb = 25 C. (3) Tamb = 150 C.
TR2 (PNP); IC/IB = 10. (1) Tamb = 150 C. (2) Tamb = 25 C. (3) Tamb = -55 C.
Fig.10 Base-emitter saturation voltage as a function of collector current.
Fig.11 Collector-emitter saturation voltage as a function of collector current: typical values.
2000 Aug 02
5
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
PACKAGE OUTLINE Plastic surface mounted package; 6 leads
BF485PN
SOT457
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.1 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT457
REFERENCES IEC JEDEC EIAJ SC-74
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2000 Aug 02
6
Philips Semiconductors
Product specification
NPN/PNP high voltage transistors
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
BF485PN
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Aug 02
7
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/550/01/pp8
Date of release: 2000
Aug 02
Document order number:
9397 750 07289


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